1
Trends of Micro- and
Nanoelectronics in the European
R&D Programme
Vesselin Dontchev
Nanoelectronics
Components and Systems
Information Society & Media Directorate-General
European Commission
Disclaimer: Views expressed in this presentation are not necessarily stating
an official position of the European Commission
EuroSimE, 18-20.04.2011, Linz, Austria
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Presentation outline






Europe 2020 – a new strategy for the EU
Current EC funding of EU Research (ICT in
particular)
Nanoelectronics- Examples of research
projects dealing with simulation
Today’s opportunities: ICT WP 2011-12
Information on the future programme (2014+)
Summary
EuroSimE, 18-20.04.2011, Linz, Austria
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A new strategy - EUROPE 2020
EUROPE 2020: A EU strategy for smart, sustainable and inclusive growth
• Smart Growth: knowledge and innovation economy
• Sustainable growth: greener and competitive economy
• Inclusive growth: high employment, knowledge
people and social and territorial cohesion
5 EU Targets – translated into national ones
7 Flagship initiatives – EU & national action
EuroSimE, 18-20.04.2011, Linz, Austria
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Europe 2020: 5 EU Headline Targets
(translated in national and regional ones)
By 2020:
• 75 % (now 69) employment rate (% of population aged 20-64 years)
• 3% (now 1,8 % only) investment in R&D (% of EU’s GDP)
• “20/20/20”
20% cut in greenhouse gas emissions (compared to 1990)
20% increase in use of renewable energy
20% cut in energy consumption through improved efficiency
• < 10% (now 15) early school leavers & min. 40% (now 31) hold
tertiary degree
• 20 million less people (now 80) should be at risk of poverty
EuroSimE, 18-20.04.2011, Linz, Austria
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Presentation outline

Europe 2020 – a new strategy for the EU

Current EC funding of EU Research
(ICT in particular)

Nanoelectronics - Examples of research
projects dealing with simulation
Today’s opportunities: ICT WP 2011-12
Information on the future programme (2014+)
Summary



EuroSimE, 18-20.04.2011, Linz, Austria
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The EU’s research and innovation landscape
Ageing (More Years Better Lives)
Climate Knowledge (Clik-EU)
Seas and Oceans
Antimicrobial resistance
Urban Europe
Water challenges
Eureka!
ERANET+
JTI Artemis, Eniac
ERANET
Clean Sky, IMI, FCH
EUROSTARS
Art. 169 AAL
Bonus EMRP
CIP
competitiveness &
innovation programme
COOPERATION
PPP
PPP (recovery packages)
ICT-FET (Flag Ships)
IDEAS - ERC
SMEs and SME Associations
Capacities (INFRASTRUCTURES)
Energy Efficient Buildings
Future of Factories
Green cars
Future Internet
PEOPLE
Fundamental
Applied
Development
Innovation
Deployment
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FP7: total of 50 B€
(2007-13)
5 major specific programmes:
C a p a citie s; 4 0 9 7 ;
8%
JR C ; 1 7 5 1 ; 3 %
Pe o p le ; 4 7 5 0 ;
9%
C o o p e ra tio n ;
Id e a s; 7 5 1 0 ; 1 5 %
FP7: Council/Parliament Co-decision
EuroSimE, 18-20.04.2011, Linz, Austria
32413; 65%
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FP7 Cooperation
Specific Programme
10 key thematic areas:
Security
Socio-economic
sciences and the
humanities
Health
Space
Food,
agriculture,
biotechnology
Transport
Environment
Energy
Nanosciences,
nanotechnologie
s, materials,
production
technologies
ICT Information
and
Communication
Technologies
9.1 B€ (2007-13)
+700M€ for eInfrastructures from the Capacities programme
EuroSimE, 18-20.04.2011, Linz, Austria
Challenges in the ICT programme 2011-2012
(What is the money spent on?)
ICT for socio-economic challenges
+AAL
1. Network and
Service ~26%
Infrastructures
~10%
~11%
~12%
~9%
~6%
~4%
5. ICT for
Health,
Ageing,
Inclusion
& Gov.
6. ICT for
LowerCarbon
Economy
7. ICT for
Manufac. &
Enterprise
8. ICT for
Learning &
Cultural
Resources
2
PPPs
2. Cognitive
Systems and
Robotics ~6%
3. Components
+JTIs
and
~17%
Systems
4. Digital ~7%
Content and
Languages
International cooperation,
Horizontal actions
PPP
~11%
Future & Emerging
Technologies (FET)
incl FI PPP
Basic ICT technologies &
infrastructures
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••• 9
0
FP7-CIP/ICT Budget Profile:
2nd half of FP7 – significant increase of funding !
M€
FP7 ICT
CIP
2007
2008
2009
2010
2011
2012
2013
TOTAL
1 189
1 217
1 227
1 241
1 382
1 582
1 760
9 598
58
52
105
113
120
135
149
732
Financial support
– FP7: master & shape research & development
– CIP: ensure wider uptake & better use of research
– + Regional and Structural Funds,…
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ICT in FP7: Where do we stand?
• In 2011, the FP7 ICT Programme is in its 5th year of
implementation
• 7 main calls have been launched and evaluated
– Total number of projects ~1200
• Launch of two JTIs and AAL initiative
– 4 Calls launched for ENIAC with 130 M€ (EC
contribution) 4th call is ongoing
• WP 2011-12 done, WP 2013 (1.76 B€) is in preparation
EuroSimE, 18-20.04.2011, Linz, Austria
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ICT in FP7
•
ICT in the FP supports collaborative R&D projects
– industry - academia from at least 3 MS or AS
– Project size between 3M€ and 20 M€ of funding
– 4 to 20 partners per project
•
Supports ~17 000 researchers and engineers/year
•
During 2007-10
– ~ 5000 distinct organisations, ~14000 participations
– ~ 1250 projects running (FP6 + FP7)
EuroSimE, 18-20.04.2011, Linz, Austria
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Presentation outline


Europe 2020 – a new strategy for the EU
Current EC funding of EU Research (ICT in
particular)

Nanoelectronics - Examples of research
projects dealing with simulation

Today’s opportunities: ICT WP 2011-12
Information on the future programme (2014+)
Summary


EuroSimE, 18-20.04.2011, Linz, Austria
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Atomics
FP6 IST programme
Advanced Front-End Technology Modeling
for Ultimate Integrated Circuits
Consortium
MOTIVATION
TCAD can save 30% development time
and costs (ITRS 2008)
OBJECTIVES
Development of TCAD models suitable for
a) materials (strained and unstrained SiGe
alloys, strained Si, SOI, etc);
b) processes (activation and diffusion of
dopants, formation of extended defects,
including low-temperature and millisecond
annealing, point-defect engineering)
employed at the 32 nm technology node and
beyond.
Budget
Total Cost: 4.4M€
EC : 2.5 M€
Example
Dependence of dopant solubility
on strain (Ahn et al. PRB 2009)
The models are
- implemented in simulation software Sentaurus (Synopsys)
- validated with respect to industrial needs (STM)
http://www.iisb.fraunhofer.de/en/arb_geb/atomics.htm
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Atemox
Advanced Technology Modeling
for Extra-Functionality Devices
Consortium
Objectives - extend the capabilities of TCAD to the prediction of
- leakage currents in CMOS structures
- the alternative doping processes considered for a reduction of
leakage currents.
Key Issues
• Full set of missing models for simulating leakage currents in
•
•
CMOS derivatives → providing extra functionality to the basic
NE technology with sizes  22 nm CMOS transistors.
Implementation and integration of the models into the
Sentaurus TCAD platform of Synopsys.
Evaluation of the integrated models by STMicroelectronics.
Expected impact
Budget
Total Cost: 4.1M€
EC Contribution: 2.85 M€
 Predictive simulations of CMOS derivatives in industrial
environments at an early stage of development.
 Significant reduction of development time and costs.
 Extending the EU knowledge and skills in NE
 Competitiveness of EU industry in CMOS derivatives
http://www.atemox.eu/
EuroSimE, 18-20.04.2011, Linz, Austria
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Presentation outline



Europe 2020 – a new strategy for the EU
Current EC funding of EU Research (ICT in
particular)
Nanoelectronics - Examples of research projects
dealing with simulation

Today’s opportunities: ICT WP 2011-12

Information on the future programme (2014+)
Summary

EuroSimE, 18-20.04.2011, Linz, Austria
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ICT Work Programme 2011-2012
Challenge 3: Alternative Paths to
Components and Systems
Objectives:
3.1. Nanoelectronics
3.2 Smart components and smart systems
3.3 Embedded systems
3.4 Computing Systems
3.5 Photonics
3.6 Organic Electronics and Photonics
8
ICT Work Programme 2011-12
Objective 3.1:
Very Advanced Nano-electronics Components
Target outcomes:
•
•
•
•
Beyond CMOS technology
Circuit - technology solutions
Nano-manufacturing and Joint Equipment
Assessment
Coordination and Support Actions
Call 8
60M€
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ICT Work Programme 2011-12
Future & Emerging Technologies – FET
Supporting high-risk transformative research in ICT
Two complementary funding schemes
FET Open
• Bottom-up approach
• Open to any research idea
FET Proactive
• Top-down approach
• Set of novel pre-defined themes
Nano-electronics related topics with EU funding ~ 30M€/year:
Molecular-scale systems, Tera-scale computing, Quantum-ICT,
Bio-Chemistry-based ICT and Towards zero power ICT
EuroSimE, 18-20.04.2011, Linz, Austria
European vision of the More Moore and More than Moore domains
Nanoelectronics
”Small, smaller, smarter”
- Advanced components in advanced systems enabling pervasive applications More than Moore: Diversification
Analog/RF
Baseline CMOS: CPU, Memory, Logic
Moore’s Law: Miniaturization
0
130nm
Passives
HV Power
Sensors
Actuators
Biochips
Interacting with people and environment
Non-digital content SoC & System-inPackage (SiP)
90nm
65nm
45nm
Information
Processing
32nm
Digital content
System-on-Chip
22nm
(SoC)
Beyond CMOS
Beyond & Extended CMOS technologies need to meet
the criteria of systemability, integratability and manufacturability
1
Objective 3.1:
Advanced Nanoelectronics Technology
Systemability
• To ensure interaction between system
competences and device technology to
better incorporate the device in a
system to perform a given function.
• To address energy efficiency needs
(e.g. for mobile applications).
• Nanoelectronics devices as system
enablers should provide solutions for
global challenges
• To prepare for “beyond” traditional
shrinking (ITRS roadmap)
EuroSimE, 18-20.04.2011, Linz, Austria
35 nm
Gate Length
2
Objective 3.1:
Advanced Nanoelectronics Technology
Integratability
• Future developments in Beyond CMOS
and More than Moore as an extendedCMOS vision. No disconnection from the
advanced silicon CMOS in order to keep
the impact of its results on the applications
and markets.
• Needs of hybridizing silicon with
molecular switches, ferromagnetic logic,
spin devices and sensors in order to enable
heterogeneous and morphic system
architectures.
ITRS-ERD vision of the role of Beyond CMOS and More than Moore elements to
form future extended CMOS platforms.
• Integrateability of novel technology with
CMOS and their reliability become key
factors.
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Objective 3.1:
Manufacturing and Equipment assessment
Manufacturability
• Concept to be taken into account at early stages of research
• From prototype to a reliable manufacturing of devices with predefined
reproducible parameters.
Semiconductor Equipment for
Wafer Bonding with Plasma Activation
EV Group, CEA-LETI, Soitec
European equipment and material companies
i) Access to nano-manufacturing and to advanced technologies
 positive feedback
ii) Joint assessment and demonstration platform
 Evidence of reproducible equipment parameters
 Stimulate the access to world wide equipment market
(especially important for SMEs)
Low Energy and Dose Implant Test
SEMILAB, Fraunhofer IISB,
ST Microelectronics Crolles II,
NXP Crolles R&D
Metrology Using X-Ray Techniques
Jordan Valley, CEA-LETI,
STMicroelectronics Crolles II,
NXP Crolles R&D
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3D Integration of Bulk Si Wafers
EV Group, CEA-LETI,
STMicroelectronics Crolles II
Ruthenium Atomic Vapor Deposition
Competitiveness in Nanoelectronic
Device Generations
AIXTRON, Fraunhofer IISB, Infineon
Munich
4
Objective 3.1
Modelling and simulation
1. Phenomena and Effects
* Quantum and atomic scale ;
* Transport (drift, diffusion );
* Electro-thermo-mechanical
* System integration at the nanoscale
2. New materials
* Graphene; Gemanene;
* Nanowires;
* CNT;
* Complex magneto-electric lattices.
3. Devices
* New switches (+molecular) and interconnects;
* Ferromagnetic logics;
* Nano-photonics devices and interconnects;
* MEMs, NEMs
* Emerging memories;
* Spin devices;
* Carbon based;
4. Models for cross technology and cross IP level simulation
5. Multi-physics and multi-scale models, which can predict devices and circuits up to
non-equilibrium systems.
Modeling & Simulation – increasing importance (save costs !)
models  measurements (challenging due to the miniaturization)
5
Objective 3.1
Information about call 8

Dates
 Open: 26 July 2011
 Close: 17 January 2012 (at 17:00 Brussels local time)


Funding schemes:
a) Beyond CMOS technology: STREPs
b) Circuit-technology solutions: STREPs and at least 1 IP
c) Nano-manufacturing and joint equipment assessment: STREPs and at least 1
IP
d) Support measures: CSAs
Indicative budget distribution - 60 M€:
 IP/STREP 55 M€
 CSA 5 M€
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ICT Proposers’ Day 2011
19 - 20 May, Budapest
Networking for European ICT R&D
• Aim of the event:
to prepare for Calls 8 and 9 (together >1 B€)
– by networking and partnerships building
– by first-hand information from >100 EC officials
• Structure:
– thematic sessions with presentations of proposal ideas
– information stands & meeting points
• Registration:
free of charge, open from January 2011
http://ec.europa.eu/ictproposersday
EuroSimE, 18-20.04.2011, Linz, Austria
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Presentation outline

Europe 2020 – a new strategy for the EU?

Current EC funding of EU Research (ICT in particular)
Nanoelectronics - Examples of research projects dealing
with simulation
Today’s opportunities: WP 2011-12



Information on the future Common Strategic
Framework (CSF) for R&I funding (2014+)

Summary
EuroSimE, 18-20.04.2011, Linz, Austria
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What is next?
2010
2011
2012
2013
2014
ICT WP 2011-12
FP7
ICT WP 2013
Preparatory work
•
•
•
•
•
9 Feb Green Paper
Feb-May Consultation based on Green Paper
10/6
Consultation ‘wrap-up’ event
KETsin Brussels
June
Proposal for next MAFF
Dec
Legislative proposal(s) for CSF
FP8 + CIPII
 CSF
(Common Strategic
Framework)
9
Common Strategic Framework (CSF)
for EU R & I funding ( 2014+ )
Three key messages
• More clarity of goals and strategy,
- Higher impact on competitiveness / society,
- More EU added value
• Simplification
Procedures but also of programmes/instruments
→ To attract wider constituency, smaller entities
• Work across silos
– research-innovation-policy priorities
– between themes and disciplines
– EU-MSs, public-private
EuroSimE, 18-20.04.2011, Linz, Austria
• Limited set of funding schemes
- common across all activities
• Unique Rules for Participation
• Simplified cost-reimbursement
approach with enhanced use of
lump sums and flat rates.
0
Common Strategic Framework for EU R&I funding (2014+)
Some first and preliminary thinking
(from ICT theme)
A challenge oriented R&I framework
A shift in the drive: From means/instruments to goals
3 sets of challenges, 4 types of activities, (funding schemes)”
Roadmap
based partn.
(Focus)
Piloting
Open, light Infrastr., skills
(attract)
(test, duffuse)
(be flexible)
Societal challenges
e.g. Living
labs
Industrial leadership
e.g. Clean
rooms,
Innovation
clusters
Excellence in science
E-Infrastruct
.
EuroSimE, 18-20.04.2011, Linz, Austria
Pilots
Pilots
1
Summary
 EUROPE 2020
- renewed emphasis on R&D&I as a basis for smart, sustainable and inclusive
growth.
 MAFF 2014+, CSF
2011-2012 is key for the preparation: New opportunities for improvements and for
holistic integrated views to face grand challenges (EU and global)
 Nanoelectronics has a major input to these processes
 Modeling & Simulation – increasing importance
 Participate in Call 8 !!!
« Time is ready. Let us profit from these exciting times and take action
---- together -----”
EuroSimE, 18-20.04.2011, Linz, Austria
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!!!! Take part in the consultation processes !!!!
!!!! 2011 is a year of change, you can influence the future !!!!
http://ec.europa.eu/yourvoice/consultations/index_en.htm
THANK YOU
[email protected]
Information Society and Media:
http://ec.europa.eu/information_society
http://cordis.europa.eu/fp7/ict/nanoelectronics/mission_en.html
European research on the web:
http://cordis.europa.eu
http://www.eniac.eu
EuroSimE, 18-20.04.2011, Linz, Austria
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Work Programme 2011-12
General concepts
Transversal Research Projects
Multi-disciplinary
cooperation
Nanostructured mat’ls
- Advanced component technology + advanced system design
- Beyond CMOS , Extended CMOS
For systems 2020 and beyond
Systemability, integratability, manufacturability
-System-technology
interaction
-Nanofabrication
-Energy efficiency
-Next switch
-Universal memory
-3D integration
-Novel architectures
5
Objective 3.1:
Very Advanced Nano-electronics Components
Target outcomes
Beyond CMOS technology
•
New switches and interconnects with energy efficiency gain;
•
Emerging memories;
•
Nano-photonics devices and interconnects;
•
Carbon based electronic devices
Circuit-technology solutions
•
Architectures including energy efficiency, spin devices ferromagnetic logics, Si with molecular switches
•
Circuit design, methodology and tools addressing e.g. D-A-C
•
Technology addressing 3D integration, MtM, photon-electron integration, power dissipation, etc.
•
Modelling and simulation
Nano-manufacturing and Joint Equipment Assessment
•
Manufacturing approaches to Beyond CMOS and MtM and their integration with nanoCMOS including 3D
•
Metrology/inspection analysis concepts; assembly and packaging
•
Joint assessment of equipment/metrology, process solutions
Coordination and Support Actions
•
Access to training CAD tools, advanced technologies, design kits, education blocks, prototyping
•
Roadmap, benchmark and strategy papers
•
Stimulation of young people towards electronics careers, training, education
•
International cooperation – Japan, USA, Taiwan, Korea
•
Support coordination and standartisation actions, preparatory work for 450 mm
6
ICT Work Programme 2013
• continuity with 2011-12 WP
• effective bridge to the next CSF for R&I.
Budget: 1.53B€
Timing - three main phases:
• Options and orientations: Sept.- Dec. 2011
• Drafting: Jan. - March/April 2012
• Decision: April/May-July 2012
7
Common Strategic Framework
for EU R&I funding (2014+)
A challenge oriented R&I framework
A shift in the drive: From means/instruments to goals
3 sets of challenges
Societal Challenges
Health and wellbeing; Safe food and sustainable agriculture; Secure, clean
and efficient energy; Green transport; less congestion; Efficient use of
resources & materials; Inclusive and safe society
Creating Industrial Leadership & Competitive Frameworks
Leadership in enabling technologies & FET; Access to risk finance;
Integrating research, education and innovation; High potential SMEs
Excellence in the Research Base
Frontier research (ERC & FET), Skills and career development (Marie
Curie); Research infrastructures incl. eInfrastructures
8
Common Strategic Framework
for EU R&I funding (2014+)
Four simplified funding schemes addressing:
• Roadmap-based partnerships (focus !)
• Open, light and fast scheme (be agile, flexible! )
• R&I infrastructures, innovation clusters, skills (attract!)
• Pilot actions in real-life settings (test and diffuse!)
9
Common Strategic Framework
for EU R&I funding (2014+)
Simplification
• Limited set of funding schemes - common
across all activities
• Unique Rules for Participation of the CSF
that will provide a set of common
principles applicable to all actions
• Radically simplified cost-reimbursement
approach with enhanced use of lump
sums and flat rates
0
Timeline
• February
Green Paper
• 4.02.2011
European Council devoted to research & innovation
• Feb-May
Consultation based on Green Paper
• 10.06.2011 Consultation ‘wrap-up’ event in Brussels
• June
Proposal for next MАFF
• December
Legislative Proposal(s) for CSF and impact
assessment
EuroSimE, 18-20.04.2011, Linz, Austria
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