THE EVOLUTION OF TECHNOLOGY
SPACES
Dave McGrath
Director Business Development
Construction, Facilities and Engineering Division
"The fatal conceit with managers is that
tomorrow will look like today..."
Peter Druker
© 2004 APC corporation.
Are we designing towards, or away from
future problems?
© 2004 APC corporation.
More…
© 2004 APC corporation.
More…
© 2004 APC corporation.
High Density – today’s problem
High Density Requirements
 Increasing power
 Increasing need for cooling
 Increasing runtime
 Increase need for
redundancy
© 2004 APC corporation.
Blade Servers
High-density is going to bite your customer
It’s not if, it’s when!
© 2004 APC corporation.
“Catch 22” for IT managers
None of the above
Poor location
Excessive facility cost
Insufficient raised floor
Insufficient power
Excessive heat
0%
5%
10%
15%
20%
25%
30%
 What is the greatest facility problem with your primary data center?
(Source: Gartner, 2006)
© 2004 APC corporation.
35%
IT
© 2004 APC corporation.
Facilities
How will it be solved
 With a Clear and Concise language on Scalable,
Modular datacenter design.
 Rack, Power, and Cooling Infrastructure will be
designed using pre-engineered modular
components and configuration tools
© 2004 APC corporation.
Traditional Design
Unable to Respond adequately
to today’s growing power and
heat loads
© 2004 APC corporation.
We must re-tool the design process
Power
Cooling
Service
Engineering
Space
Improvements
Racks
Thinking about Data Centers “by the square foot”
is obsolete
© 2004 APC corporation.
Blade Server Power Draw
Max Power Supply Watts
Watts per Chassis by Blade Model
25,000
733 W/SF
20,000
500 W/SF
15,000
HP
Dell
10,000
Sun
5,000
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14
# of Chassis (Max to a 42U Rack)
© 2004 APC corporation.
IBM
Density Power & Cooling Challenges
18kW
18 kW
POWER
3 kW
3 kW
3 kW
30-amp circuits
208 / 230 V
3 kW
3 kW
3 kW
(Assume dual-corded blade chassis)
© 2004 APC corporation.
18 kW
COOLING
The Cooling Challenge
18kW
3 kW
3 kW
3 kW
2500 cfm
3 kW
3 kW
3 kW
© 2004 APC corporation.
2500 cfm
Limits of Floor Tile Cooling
Additionally requires
grate-type tiles
500-700 cfm
Grate tile
Perf tile
12
Typical
Capability
10
With
Effort
Extreme
Impractical
Rack 8
Power 6
(kW)
that can be
cooled by one4
tile with this
airflow
2
0
© 2004 APC corporation.
0
100
[47.2]
200
[94.4]
300
[141.6]
400
[188.8]
500
[236.0]
600
[283.2]
700
800
900
[330.4] [377.6] [424.8]
1000
[471.9]
Traditional Configuration
© 2004 APC corporation.
Room-oriented cooling airflow patterns
© 2004 APC corporation.
In Row Configuration (Coupled Cooling)
© 2004 APC corporation.
Row-oriented cooling airflow patterns
Predictable
Performance
© 2004 APC corporation.
Alternative cooling architectures
Method
Application
Density
Traditional roomoriented raised
floor cooling
Low density
Very flexible
1-5kW per rack
In-row
Medium density
General use
3-15kW per rack
In-row with hot
aisle containment
Very high density
Targeted zones
Assured redundancy
10-25kW per rack
Rack-coupled
Very high density specific
racks
Mix of very high and low
density
20-45kW per rack
© 2004 APC corporation.
Why is it so critical to address during
design?
Cooling
problem
Efficiency
problem
Rate of change
problem
© 2004 APC corporation.
In-row rack-coupled architecture
 “Coupled” to adjacent IT
racks
 Up to 40kW rating today
with efficient designs
 Higher availability via N+1
standards
 Predictable performance
 Mix into existing legacy
data center
InfraStruXure Cooling Distribution Unit
© 2004 APC corporation.
IDC: Time to push ‘reboot’ button…
“…it appears that it will be
cheaper to build new
datacenters to accommodate
blades than to attempt to retrofit
the existing ones…”
© 2004 APC corporation.
It is getting to the CEO’s plate…
“Power will be #1 design issue for many IT shops over
next two to three years…”
“RFG predicts that power and cooling costs will
increase to more than one-third of the total IT budget.
This will elevate this cost element into a priority
position for CFOs, facilities managers, and IT
executives.”
“Coordination with facilities management is crucial to
successful power and cooling planning”
-Robert Frances Group, January 06
© 2004 APC corporation.
We must all pay close attention…
© 2004 APC corporation.
Density is driving an unprecedented collision
between IT, Facilities and vendors
 We have a shared problem
 The traditional solutions won’t work, and the typical
solution providers are either focused on making the
problem worse or hoping it goes away
 The shared problem is getting bigger and hairier by
the minute
 We need a shared language to promote learning
 Learning offers an opportunity for standardization,
leading to lower costs, higher availability, and much
greater productivity
 Everyone has to decide if they are part of the problem
or part of the solution
© 2004 APC corporation.
Network-Critical Physical Infrastructure (NCPI)
Essential
foundation of
reliability
© 2004 APC corporation.
Rack Power
 Implement designs with a completely scalable and
modular approach at the rack level
 Rack Power delivery must be scalable in response to
density variation
 Rack Power must be redundant (UPS N+1 or greater)
 Rack Power design must be completely flexible in
configuration and voltage
 The Rack is the Basic Building Block of any IT
deployment.
© 2004 APC corporation.
Design the rack accordingly
Rack
Configuration:
 Select rack
 IT actual loads



reflected in
design
Simulate 3rd party
equipment
Model power
Model airflow
© 2004 APC corporation.
Scale & Manage Power at the Rack
1.4 kW - 12.5 kW, 15A - 50A, Horizontal or Vertical Mount
 Control individual
outlets
 Turn unused

outlets off
Recycle power to
locked-up
equipment
 Monitor current
 Avoid overloads
 Balance loads
across phases
 Power highdensity racks
 Multi-branch
units supports
12.5kW
 Sequence power-on
 Avoid in-rush current
 Fit up to 4

Switched Rack PDU
© 2004 APC corporation.
units in one
rack
42 outlets on
one strip
Manage at the Row / Room
© 2004 APC corporation.
Rack Cooling
 Eliminate the unpredictable nature of traditional
cooling architectures in dense environments
 Closely couple the IT load with cooling capacity
 Increase Capacity per rack
 Increase Cooling Efficiency
 Model the cooling requirements from day 1 and be
prepared to adapt to change
 Power In equals Heat Out
 design in accordance with the dynamic nature of the load
© 2004 APC corporation.
CFD model of in-row with Hot Aisle
Containment: Modeling failure of one CRAC
© 2004 APC corporation.
Rack-by-rack airflow analysis for various
failure conditions in real time during design
© 2004 APC corporation.
Integrate it all into Your Management
Architecture
Building Management System
Integration
Manage critical building infrastructure from
single system via modbus RTU
Enterprise Management
System Integration
Network
Manager
Enterprise
Management
System
InfraStruXure®
Manager
Storage
Manager
Server
Manager
Cooling Devices
Storage
Devices
Server
Devices
© 2004 APC corporation.
Similar to server, storage and
networking equipment.
Building
Management
System
Forward SNMP traps to your
preferred management system
Network
Devices
Building
Power Comfort Air
Building
Environment
Manage NetworkCritical Physical
Infrastructure
Rack Devices
Power Devices
Scalability
Manage up to 1000
APC networked
devices
Summary
“Man must sit in chair for very
long time before roast duck fly
in mouth…”
Chinese Proverb
Take Action …understand the Rack Level
challenges and design accordingly!
© 2004 APC corporation.
Look
out
for
the
Shark!
And of course…
© 2004 APC corporation.
For further information on these topics
consult APC white papers at www.apc.com
 #130 The Advantage of Row and  #125 Strategies for Deploying
Rack-Oriented Cooling
Architectures for Data Centers
 #131 Improved Chilled Water
Piping Distribution Methodology
for Data Centers
© 2004 APC corporation.
Blade Servers in Existing
Data Centers
 #43 Dynamic Power
Variations in Data Centers
and Network Rooms
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THE EVOLUTION OF TECHNOLOGY SPACES